|
IEC-60747-7-3
|
2004
|
Semiconductor devices Discrete devices-Part 7 : Bipolar transistors-Section 3:Blank detail specifica
|
|
IEC-60747-7-4
|
2004
|
Semiconductor devices Discrete devices Part 7 : Bipolar transistors -Section 4:Blank detail specifi
|
|
IEC-60747-8
|
2000
|
Semiconductor devices - Discrete devices - Part 8: Field-effect transistors - Edition 3.0
|
|
IEC-60747-8-1
|
2004
|
Semiconductor devices Discrete devices - Part 8 : Field effect transistorsSection 1:Blank detail sp
|
|
IEC-60747-8-2
|
2000
|
Semiconductor Devices Discrete Devices Part 8: Field-Effect Transistors Section Two - Blank Detail S
|
|
IEC-60747-8-3
|
2000
|
Semiconductor Devices - Discrete Devices - Part 8: Field-Effect Transistors - Section 3: Blank Detai
|
|
IEC-60747-8-4
|
2000
|
Discrete semiconductor devices Part 8-4: Metal-oxide-semiconductor field-effect transistors (MOSFETs
|
|
IEC-60747-9
|
2000
|
Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) - edit
|
|
IEC-60748-1
|
2001
|
Semiconductor devices R08; Integrated circuits.Part 1: General
|
|
IEC-60748-11
|
2000
|
Semiconductor Devices - Integrated Circuits Part 11: Sectional Specification for Semiconductor Integ
|
|
IEC-60748-11-1
|
2000
|
Semiconductor Devices Integrated Circuits Part 11: Section 1: Internal Visual Examination for Semico
|
|
IEC-60748-2
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits - Second Edition
|
|
IEC-60748-20
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Cir
|
|
IEC-60748-20-1
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Cir
|
|
IEC-60748-21
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 21: Sectional Specification for Film Integrated C
|
|
IEC-60748-2-1
|
2000
|
Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section One - Blank De
|
|
IEC-60748-2-10
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits - Section 10: Blan
|
|
IEC-60748-2-11
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 2-11: Digital Integrated Circuits - Blank Detail
|
|
IEC-60748-21-1
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 21-1: Blank Detail Specification for Film Integra
|
|
IEC-60748-2-12
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 2-12: Digital Integrated Circuits - Blank Detail
|
|
IEC-60748-22
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 22: Sectional Specification for Film Integrated C
|
|
IEC-60748-2-2
|
2000
|
Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Two - Family S
|
|
IEC-60748-2-20
|
2000
|
Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specif
|
|
IEC-60748-22-1
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 22-1: Blank Detail Specification for Film Integra
|
|
IEC-60748-2-3
|
2000
|
Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Three - Blank
|
|
IEC-60748-23-1
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 23-1: Hybrid Integrated Circuits and Film Structu
|
|
IEC-60748-23-2
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 23-2: Hybrid Integrated Circuits and Film Structu
|
|
IEC-60748-23-3
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 23-3: Hybrid Integrated Circuits and Film Structu
|
|
IEC-60748-23-4
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 23-4: Hybrid Integrated Circuits and Film Structu
|
|
IEC-60748-23-5
|
2000
|
Semiconductor devices Integrated circuits Part 23-5: Hybrid integrated circuits and film structures
|
|
IEC-60748-2-4
|
2000
|
Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Four - Family
|
|
IEC-60748-2-5
|
2000
|
Semiconductor devices Integrated circuits Part 2: Digital integrated circuits Section five - Blank d
|
|
IEC-60748-2-6
|
2000
|
Semiconductor devices Integrated circuits Part 2: Digital integrated circuits Section six - Blank de
|
|
IEC-60748-2-7
|
2000
|
Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Seven - Blank
|
|
IEC-60748-2-8
|
2000
|
Semiconductor Devices Integrated Circuits - Part 2: Digital Integrated Circuits - Section Eight - Bl
|
|
IEC-60748-2-9
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits - Section 9: Blank
|
|
IEC-60748-3
|
2002
|
Semiconductor devicesW29; Integrated circuits,Part3: Recommendation for analogue integrated circuits
|
|
IEC-60748-3-1
|
2000
|
Semiconductor Devices Integrated Circuits Part 3: Analogue Integrated Circuits Section One - Blank D
|
|
IEC-60748-4
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 4: Interface Integrated Circuits - Second Edition
|
|
IEC-60748-4-1
|
2000
|
Semicondutor Devices - Integrated Circuits - Part 4: Interface Integrated Circuits - Section 1: Blan
|
|
IEC-60748-4-2
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 4: Interface Integrated Circuits - Section 2: Bla
|
|
IEC-60748-4-3
|
2006
|
Semiconductor devices –Integrated circuits –Part 4-3:Interface integrated circuits – Dynamic criteri
|
|
IEC-60748-5
|
2000
|
Semiconductor Devices - Integrated Circuits - Part 5: Semicustom Integrated Circuits - First Edition
|
|
IEC-60749-1
|
2000
|
Semiconductor devices - Mechanical and climatic test methods - Part 1: General - First Edition
|
|
IEC-60749-10
|
2000
|
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock - First Edi
|
|
IEC-60749-11
|
2000
|
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 11: Rapid Change of Temperature
|
|
IEC-60749-12
|
2000
|
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 12: Vibration, Variable Frequenc
|
|
IEC-60749-13
|
2000
|
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 13: Salt Atmosphere - First Edit
|
|
IEC-60749-14
|
2000
|
Semiconductor devices Mechanical and climatic test methods Part 14: Robustness of terminations (lead
|
|
IEC-60749-15
|
2000
|
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temp
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